Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject MOIRE INTERFEROMETRY
Showing results 1 to 3 of 3
| A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 |
| Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09 |
| Numerical and experimental investigation of a complete contact problem by comparing with an asymptotic analysis Jang, Jae-Won; Kim, Hyung-Kyu; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.82, pp.39 - 46, 2016-03 |
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