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Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 |
Effects of graphene oxide on the electromigration lifetime of lead-free solder joints Ko, Yong Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek-Soo, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.3, pp.2334 - 2341, 2019-02 |
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