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1
Development of a compact micro-stereolithography (MSTL) system using a Blu-ray optical pickup unit

Kang, Hyun-Wook; Jeong, Young-Seok; Lee, Seung-Jae; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.22, no.11, 2012-11

2
Elastic region of an ACF joint for thermosonic flip-chip bonding

Ha, Chang-Wan; Jang, Tae-Young; Kim, Kyung-Rok; Yun, Won-Soo; Kim, Kyung-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.9, 2011-09

3
Optimization and reliability evaluation of COG bonding process

Jeong, Young Hun; Jung, Seung-Won; Jin, Songwan; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.30, no.3, pp.1305 - 1313, 2016-03

4
Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film

Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Soo; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03

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