Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Kwon, WS

Showing results 1 to 8 of 8

1
Application of light hydrocracked base oils for automatic transmission fluids

Kwon, WS; Kim, Kyung-Woong; Yang, SW; Henderson, H. E., The Third Asia International Conference on Tribology (ASIATRIB 2006), pp.753 - 754, 2006-10-19

2
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

3
Effects of Dumbbell Blending of Light Hydrocracked Base Oil on the Properties of Automatic transmission Fluids

Kwon, WS; Henderson, H.E.; Kim, Kyung-Woong, 60th STLE 2005 Annual Meeting & Exhibition, pp.200 -, 2005-05

4
Effects of Light Hydrocracked Base Oil on the Performance of ATF

Kwon, WS; Yang, S.W.; Moon, WS; Kim, Kyung-Woong, International Symposium on the Tribology of Vehicle Transmission, pp.80 - 85, 2005-02-16

5
In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition

Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06

6
The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling

Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737, IEEE, 2004-06-01

7
The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection

Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31

8
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

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