Showing results 1 to 8 of 8
Depth dependence of ultraviolet curing of organosilicate low-k thin films Kim, Taek-Soo; Tsuji, Naoto; Kemeling, Nathan; Matsushita, Kiyohiro; Geisler, Holm; Zschech, Ehrenfried; Dauskardt, Reinhold H., JOURNAL OF APPLIED PHYSICS, v.103, no.6, 2008-03 |
Integration Challenges of Nanoporous Low Dielectric Constant Materials Kim, Taek-Soo; Dauskardt, Reinhold H., IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.9, no.4, pp.509 - 515, 2009-12 |
Molecular Mobility under Nanometer Scale Confinement Kim, Taek-Soo; Dauskardt, Reinhold H., NANO LETTERS, v.10, no.5, pp.1955 - 1959, 2010-05 |
Surfactant Mobility in Nanoporous Glass Films Kim, Taek-Soo; Mackie, Katherine; Zhong, Qiping; Peterson, Maria; Konno, Tomohisa; Dauskardt, Reinhold H., NANO LETTERS, v.9, no.6, pp.2427 - 2432, 2009-06 |
Surfactant-controlled damage evolution during chemical mechanical planarization of nanoporous films Kim, Taek-Soo; Konno, Tomohisa; Dauskardt, Reinhold H., ACTA MATERIALIA, v.57, no.16, pp.4687 - 4696, 2009-09 |
Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films Kim, Taek-Soo; Chumakov, Dmytro; Zschech, Ehrenfried; Dauskardt, Reinhold H., APPLIED PHYSICS LETTERS, v.95, no.7, 2009-08 |
Tuning depth profiles of organosilicate films with ultraviolet curing Kim, Taek-Soo; Tsuji, Naoto; Matsushita, Kiyohiro; Kobayashi, Nobuyoshi; Chumakov, Dmytro; Geisler, Holm; Zschech, Ehrenfried; et al, JOURNAL OF APPLIED PHYSICS, v.104, no.7, 2008-10 |
Understanding mechanical behavior and reliability of organic electronic materials Kim, Jae Han; Lee, Inhwa; Kim, Taek-Soo; Rolston, Nicholas; Watson, Brian L.; Dauskardt, Reinhold H., MRS BULLETIN, v.42, no.2, pp.115 - 123, 2017-02 |
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