Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject thermomechanical analysis
Showing results 1 to 3 of 3
| A study on the thermomechanical behavior of semiconductor chips on thin silicon substrate Lim, Jae Hyuk; Han, ManHee; Lee, Jun-Youn; Earmme, Youn Young; Lee, Soon-Bok; Im, Seyoung, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.22, no.8, pp.1483 - 1489, 2008-08 |
| Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09 |
| 열 하중을 받고 있는 다층구조물에 대한 열 기계적 해석과 파괴역학의 적용 = Thermomechanical and fracture mechanical analysis of multilayered structure subjected to thermal loadinglink 임지혁; Lim, Ji-Hyuk; et al, 한국과학기술원, 2001 |
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