Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject effective material property
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| Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging Shin, DK; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.21, no.4, pp.413 - 421, 1998-11 |
| Evaluation of effective material properties of composite materials using special FEM Yang, CH; Huh, Hoon; Hahn, TH, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.140Special, no.SI, pp.185 - 190, 2003-09 |
| Investigation of effective material properties in composites with internal defect or reinforcement particles Yang, CH; Huh, Hoon; Hahn, HT, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.42, no.24-25, pp.6141 - 6165, 2005-12 |
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