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3차원 적층 패키지용 인터커넥션 공정에 관한 연구 = A study on interconnection process of 3D packaginglink 김선락; Kim, Sun-Rak; et al, 한국과학기술원, 2013 |
Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching Kim, Kwang-Seok; Lee, Young-Chul; Ahn, Jee-Hyuk; Song, Jun Yeob; Yoo, Choong D.; Jung, Seung-Boo, KOREAN JOURNAL OF METALS AND MATERIALS, v.48, no.11, pp.1028 - 1034, 2010-11 |
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