Showing results 1 to 6 of 6
Analysis and Simulation of the Failure Characteristic of a Single Leg Bending Joint with a Micro-Patterned Surface Lee, Min Jung; Kim, Won Seock; Jang, Chang Jae; Kim, Kyoung Hwan; Cho, Tae Min; Lee, Byung Chai; Lee, Jung Ju, JOURNAL OF ADHESION, v.87, no.7-8, pp.826 - 841, 2011-08 |
Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
Determination of cohesive parameters for a mixed-mode cohesive zone model Lee, Min Jung; Cho, Tae Min; Kim, Won Seock; Lee, Byung Chai; Lee, Jung Ju, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.30, no.5, pp.322 - 328, 2010-07 |
Finite Element Analysis of an Adhesive Joint Using the Cohesive Zone Model and Surface Pattern Design of Bonding Surfaces Lee, Min-Jung; Lim, Jong-Min; Lee, Byung-Chai, JOURNAL OF ADHESION, v.89, no.3, pp.205 - 224, 2013-03 |
Simulation of adhesive joints using the superimposed finite element method and a cohesive zone model Kim, Young-Tae; Lee, Min-Jung; Lee, Byung-Chai, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.31, pp.357 - 362, 2011-07 |
TORQUE TRANSMISSION CAPABILITIES OF BONDED POLYGONAL LAP JOINTS FOR CARBON-FIBER EPOXY COMPOSITES CHOI, JK; Lee, Dai Gil, JOURNAL OF ADHESION, v.48, no.1-4, pp.235 - 250, 1995 |
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