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Effects of graphene oxide on the electromigration lifetime of lead-free solder joints Ko, Yong Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek-Soo, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.3, pp.2334 - 2341, 2019-02 |
Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections Lee, Hyeonchul; Jeong, Minsu; Kim, Gahui; Son, Kirak; Seo, Jeongmin; Kim, Taek-Soo; Park, Young-Bae, ELECTRONIC MATERIALS LETTERS, v.16, no.4, pp.311 - 320, 2020-07 |
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