Showing results 1 to 1 of 1
Adaptive bonding technique for precise assembly of three-dimensional microstructures Park, SH; Jeong, JH; Choi, DG; Kim, KD; Altun, AO; Lee, ES; Yang, Dong-Yol; et al, APPLIED PHYSICS LETTERS, v.90, no.23, pp.6883 - 6888, 2007-06 |
Discover