Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Paik, Kyung-Wook
Showing results 36 to 37 of 37
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
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