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Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.28, no.1, pp.96 - 105, 2015-02 |
Superstrength through Nanotwinning An, Qi; Goddard, William A., III; Xie, Kelvin Y.; Sim, Gi-dong; Hemker, Kevin J.; Munhollon, Tyler; Toksoy, M. Fatih; et al, NANO LETTERS, v.16, no.12, pp.7573 - 7579, 2016-12 |
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