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Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
Damage tolerance of composite toecap Lee, SM; Lim, TS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.67, no.2, pp.167 - 174, 2005-02 |
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