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Aluminium-based packaging platform for LED using selectively anodising method Kim, Kyoung Min; Shin, S. H.; Lee, Y. K.; Choi, Sangmin; Kwon, Young Se, ELECTRONICS LETTERS, v.44, no.1, pp.24 - 25, 2008-01 |
Automatic Generation of Mesh with Surface Element Layers and Cope Mesh for Finite Element Simulation of Metal Forming Processes Yang, Dong-Yol; Lee, Y. K., NUMIFORM'98, 1998 |
Three-Dimensional Finite Element Anlaysis for Industrial Hollow Section Extrusion of Multiply-Connected Sections Using Mismatching Refinement Yang, Dong-Yol; Park, K.; Lee, Y. K.; Lee, D. H., 6th ICTP , pp.1807 - 1812, 1999 |
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