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Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force Shin, Dong Kil; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.2, pp.248 - 258, 2014-02 |
Built-up edge analysis of orthogonal cutting by the visco-plastic finite-element method Kim, Jeong-Du; Marinov, VR; Kim, DS, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.71, no.3, pp.367 - 372, 1997-11 |
Three-dimensional simulation of elastic capsules in shear flow by the penalty immersed boundary method Huang, Wei-Xi; Chang, Cheong-Bong; Sung, Hyung-Jin, JOURNAL OF COMPUTATIONAL PHYSICS, v.231, no.8, pp.3340 - 3364, 2012-04 |
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