Browse "Dept. of Mechanical Engineering(기계공학과)" by Title
Showing results 10521 to 10540 of 36494
| Fatigue damage monitoring of aluminum plate patched with CFRP composite using optical fiber sensors Lee, D. C.; Lee, Jungju; Seo, D. C., The 9th International Conference on Composite Engineering(ICCE/9), pp.124 - 127, 2000-07 |
| Fatigue damage monitoring of aluminum plate patched with CFRP composites using embedded optical fiber sensors Seo, D.C.; Kim, S.H.; Lee, Jungju, International Conference on ADVANCED TECHNOLOGY (ATEM01), pp.846 - 850, 2001 |
| Fatigue damage monitoring of composite laminates using embedded intensity-based optical fiber sensors Lee, D. C.; Lee, Jungju, The 1st Asian-Australasian Conference on Composite Materials(ACCM/1), pp.6321 - 6324, 1998-10-07 |
| Fatigue damage monitoring of composite patched structures using optical fiber sensors Kim, S. H.; Seo, D. C.; Lee, Jungju, The 10th International Conference On Composites /Nano Engineering (ICCE/10), ICCE, 2003-07-20 |
| Fatigue Failure of an Ion-nitrided Steel under Push Pull Loading 엄윤용, 대한기계학회 춘계학술대회 초록집, pp.75 - 79, 1981 |
| Fatigue failure of welded vertical members of a steel truss bridge Lee, Soon-Bok, ENGINEERING FAILURE ANALYSIS, v.3, no.2, pp.103 - 108, 1996-06 |
| Fatigue life and plastic deformation behavior of electrodeposited copper thin film under variable amplitude loading Lee, Do-Young; Song, Ji-Ho, INTERNATIONAL JOURNAL OF FATIGUE, v.38, pp.1 - 6, 2012-05 |
| Fatigue life and plastic deformation behavior of electrodeposited copper thin films Hwangbo, Yun; Song, Ji Ho, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.527, no.9, pp.2222 - 2232, 2010-04 |
| Fatigue life assessment of bump type solder joint under vibration environment Lee, Soon-Bok; Ham, SJ, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, pp.699 - 704, 1999-06-13 |
| Fatigue life evaluation of lead-free solder under thermal and mechanical loads Kim, I; Lee, Soon-Bok, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.95 - 104, IEEE, 2007-05-29 |
| Fatigue life evaluation of pinion gears for the reliability of pitch systems in wind turbines Kim, Si Won; Lee, Yong Seok; Jang, Dong Won; Choi, Jung Chul; Lee, Soon-Bok, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.31, no.2, pp.753 - 758, 2017-02 |
| Fatigue Life Predictions for Variable Load Histories-Part 1: Fatigue Crack Initiation Life j.s.ha; j.h.song; s.j.lee, 대한기계학회논문집 A, v.12, no.4, pp.760 - 780, 1988 |
| Fatigue Life Predictions for Variable Load Histories-Part II : Computer Softwae for Predictions of Fatigue Crack Initiation Life s.j.lee; j.h.song; j.s.ha, 대한기계학회논문집, v.12, no.6, pp.1350 - 1357, 1988 |
| FATIGUE MICROCRACKS IN TYPE-304 STAINLESS-STEEL AT ELEVATED-TEMPERATURE SUH, CM; Lee, Jungju; KANG, YG, FATIGUE FRACTURE OF ENGINEERING MATERIALS STRUCTURES, v.13, no.5, pp.487 - 496, 1990 |
| Fatigue of polymer-supported Ag thin films Sim, Gidong; Hwangbo, Yun; Kim, Hyun-Ho; Lee, Soon-Bok; Vlassak, Joost J., SCRIPTA MATERIALIA, v.66, no.11, pp.915 - 918, 2012-06 |
| Fatigue Strength Evaluation of Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints under Mixed Mode Loading Cases Park, Tae-Sang; Lee, Soon-Bok, KSME 2002 Conferece of Materials and Fracture Division, KSME 02MF026, pp.164 - 170, 2002 |
| Fatigue-creep interaction behaviour at elevated temperature Suh, C.M.; Lee, Jungju; Lee, S.D., KSOE Annual Conference, pp.74 - 77, 1988-07 |
| FATIGUE-STRENGTH AND FRACTURE MECHANISM OF CERAMIC-METAL JOINTS UNDER CYCLIC BENDING Lee, Soon-Bok; Kobayashi, H; Huh, JW, INTERNATIONAL JOURNAL OF FATIGUE, v.17, no.6, pp.427 - 435, 1995-08 |
| Fault detection and identification method using observer-based residuals Jeong, Haedong; Park, Bumsoo; Park, Seungtae; Min, Hyungcheol; Lee, Seungchul, RELIABILITY ENGINEERING & SYSTEM SAFETY, v.184, pp.27 - 40, 2019-04 |
| Fault detection in a ball bearing system using minimum variance cepstrum Choi, Young-Chul; Kim, Yang-Hann, MEASUREMENT SCIENCE & TECHNOLOGY, v.18, no.5, pp.1433 - 1440, 2007-05 |
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