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A simple and novel method for the evaluation of adhesion properties between UV curable resin and stamp in UV-nanoimprint lithography (UV-NIL) Heo, Jung-Chul; Kim, Kwang-Seop; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.98, pp.64 - 69, 2012-10 |
Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test Kim, Kwang-Seop; Kang, Ji-Hoon; Choi, Dae-Geun; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.88, no.6, pp.855 - 860, 2011-06 |
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