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BGA 패키지의 열피로 특성에 관한 연구 = A study on thermal fatigue behavior of BGA packagelink 김일호; Kim, Il-Ho; et al, 한국과학기술원, 2004 |
Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging Lee, Soon-Bok; Park, TS; Ham, SJ, JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v.43, no.4, pp.400 - 407, 2000-10 |
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