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Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, J.-W.; Suk, K.-L.; Paik, K.-W.; Lee, Soon-Bok, PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, v.7522, no.0, pp.0 - 0, 2010 |
자동차용 파워모듈 솔더접합부의 신뢰성 평가에 관한 연구 = A study on reliability evaluation of solder joints in automotive power module packagelink 왕웅재; Wang, Wung Jae; et al, 한국과학기술원, 2016 |
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