Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Yim, MJ | - |
| dc.contributor.author | Kwon, WS | - |
| dc.date.accessioned | 2013-03-16T09:07:49Z | - |
| dc.date.available | 2013-03-16T09:07:49Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-04-01 | - |
| dc.identifier.citation | The 6th International Symposium on Microelectronics and Packaging, v., no., pp.0 - 0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/129673 | - |
| dc.language | ENG | - |
| dc.title | Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | The 6th International Symposium on Microelectronics and Packaging | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yim, MJ | - |
| dc.contributor.nonIdAuthor | Kwon, WS | - |
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