Study on Coined Solder Bumps on Micro-via PCBs
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Nah, JW | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Kim, WH | ko |
| dc.contributor.author | Hur, KR | ko |
| dc.date.accessioned | 2013-03-16T08:53:12Z | - |
| dc.date.available | 2013-03-16T08:53:12Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-11 | - |
| dc.identifier.citation | Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/129565 | - |
| dc.language | English | - |
| dc.publisher | 3rd International Symposium on Electronic Materials and Packaging | - |
| dc.title | Study on Coined Solder Bumps on Micro-via PCBs | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000175586500023 | - |
| dc.identifier.scopusid | 2-s2.0-0009555809 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 115 | - |
| dc.citation.endingpage | 120 | - |
| dc.citation.publicationname | Proceeding of the 3rd International Symposium on Electronic Materials and Packaging | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Jeju | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Nah, JW | - |
| dc.contributor.nonIdAuthor | Kim, WH | - |
| dc.contributor.nonIdAuthor | Hur, KR | - |
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