A Study on the behavior of residual stress with water absorption of Si of thin films deposited by electron cyclortron resonance plasma enhanced chemical vapor deposition method
- Issue Date
- 2001
- Language
- ENG
- Citation
2001 MRS Fall Meeting, pp.124 -
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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