Study on the Under Bump Metallutgy(UBM) for electro-plated Eutectic Pb/Sn Soder Bumps on Organic Substrates
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Jang, SY | - |
| dc.date.accessioned | 2013-03-16T07:29:30Z | - |
| dc.date.available | 2013-03-16T07:29:30Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-02-01 | - |
| dc.identifier.citation | Pan Pacific Microelectronics Symposium, v., no., pp.173 - 179 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/128878 | - |
| dc.language | ENG | - |
| dc.title | Study on the Under Bump Metallutgy(UBM) for electro-plated Eutectic Pb/Sn Soder Bumps on Organic Substrates | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 173 | - |
| dc.citation.endingpage | 179 | - |
| dc.citation.publicationname | Pan Pacific Microelectronics Symposium | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, SY | - |
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