An undergraduate class for high-frequency design, fabrication, and measurement
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | - |
| dc.contributor.author | Ahn, S. | - |
| dc.contributor.author | Park, B. | - |
| dc.contributor.author | Chung, Y. | - |
| dc.date.accessioned | 2013-03-16T06:53:58Z | - |
| dc.date.available | 2013-03-16T06:53:58Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-07-08 | - |
| dc.identifier.citation | Advances in Electronic Packaging, v.3, no., pp.1827 - 1830 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/128587 | - |
| dc.language | ENG | - |
| dc.title | An undergraduate class for high-frequency design, fabrication, and measurement | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0346308195 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 3 | - |
| dc.citation.beginningpage | 1827 | - |
| dc.citation.endingpage | 1830 | - |
| dc.citation.publicationname | Advances in Electronic Packaging | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Ahn, S. | - |
| dc.contributor.nonIdAuthor | Park, B. | - |
| dc.contributor.nonIdAuthor | Chung, Y. | - |
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