DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bae, S.H. | - |
dc.contributor.author | So, J.-H. | - |
dc.contributor.author | Yang, Seung-Man | - |
dc.contributor.author | Kim, D.H. | - |
dc.date.accessioned | 2013-03-16T06:35:17Z | - |
dc.date.available | 2013-03-16T06:35:17Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000-04-26 | - |
dc.identifier.citation | Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues, v.613, no., pp.114 - 115 | - |
dc.identifier.issn | 0272-9172 | - |
dc.identifier.uri | http://hdl.handle.net/10203/128441 | - |
dc.language | ENG | - |
dc.title | Performance of polishing slurries containing silica particles grown by sol-gel method | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0034432901 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 613 | - |
dc.citation.beginningpage | 114 | - |
dc.citation.endingpage | 115 | - |
dc.citation.publicationname | Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Yang, Seung-Man | - |
dc.contributor.nonIdAuthor | Bae, S.H. | - |
dc.contributor.nonIdAuthor | So, J.-H. | - |
dc.contributor.nonIdAuthor | Kim, D.H. | - |
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