DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwon, WS | - |
dc.contributor.author | Jang, KW | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-16T04:53:21Z | - |
dc.date.available | 2013-03-16T04:53:21Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-11 | - |
dc.identifier.citation | 3rd International Symposium on Electronic Materials and Packagings 2001, v., no., pp.34 - 38 | - |
dc.identifier.uri | http://hdl.handle.net/10203/127623 | - |
dc.language | ENG | - |
dc.title | High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 34 | - |
dc.citation.endingpage | 38 | - |
dc.citation.publicationname | 3rd International Symposium on Electronic Materials and Packagings 2001 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kwon, WS | - |
dc.contributor.nonIdAuthor | Jang, KW | - |
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