Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, Jin | - |
| dc.contributor.author | Son, JY | - |
| dc.date.accessioned | 2013-03-16T04:38:59Z | - |
| dc.date.available | 2013-03-16T04:38:59Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | MRS Proc., v., no., pp.N6.2.1 - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/127529 | - |
| dc.language | ENG | - |
| dc.title | Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | N6.2.1 | - |
| dc.citation.publicationname | MRS Proc. | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Son, JY | - |
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