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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Measurement of Metal/Polymer Interfacial Fracture energy in Microelectron in Packaging

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dc.contributor.authorYu, Jin-
dc.contributor.authorSong, JY-
dc.date.accessioned2013-03-16T03:07:45Z-
dc.date.available2013-03-16T03:07:45Z-
dc.date.created2012-02-06-
dc.date.issued2000-12-01-
dc.identifier.citation3rd Electronics.Packaging Technology Conference(EPTC2000), v., no., pp.246 - 250-
dc.identifier.urihttp://hdl.handle.net/10203/126805-
dc.languageENG-
dc.titleMeasurement of Metal/Polymer Interfacial Fracture energy in Microelectron in Packaging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage246-
dc.citation.endingpage250-
dc.citation.publicationname3rd Electronics.Packaging Technology Conference(EPTC2000)-
dc.identifier.conferencecountrySingapore-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorSong, JY-
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MS-Conference Papers(학술회의논문)
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