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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Microwave frequency model of water level package and increased loading effect on rambus memory module

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dc.contributor.authorLee, J.-
dc.contributor.authorChoi, B.-
dc.contributor.authorAhn, S.-
dc.contributor.authorRyu, W.-
dc.contributor.authorKim, J.M.-
dc.contributor.authorChoi, K.S.-
dc.contributor.authorHong, J.-K.-
dc.contributor.authorChun, H.-S.-
dc.contributor.authorKim, Joungho-
dc.date.accessioned2013-03-16T02:44:08Z-
dc.date.available2013-03-16T02:44:08Z-
dc.date.created2012-02-06-
dc.date.issued2001-05-29-
dc.identifier.citation51st Electronic Components and Technology Conference, v., no., pp.128 - 132-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/126609-
dc.languageENG-
dc.titleMicrowave frequency model of water level package and increased loading effect on rambus memory module-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0034822059-
dc.type.rimsCONF-
dc.citation.beginningpage128-
dc.citation.endingpage132-
dc.citation.publicationname51st Electronic Components and Technology Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorChoi, B.-
dc.contributor.nonIdAuthorAhn, S.-
dc.contributor.nonIdAuthorRyu, W.-
dc.contributor.nonIdAuthorKim, J.M.-
dc.contributor.nonIdAuthorChoi, K.S.-
dc.contributor.nonIdAuthorHong, J.-K.-
dc.contributor.nonIdAuthorChun, H.-S.-
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EE-Conference Papers(학술회의논문)
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