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Microwave frequency model of flip-chip interconnects using anisotropic conductive film

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dc.contributor.authorRyu, Woong Hwanko
dc.contributor.authorYim, Myung-Jinko
dc.contributor.authorLee, Junhoko
dc.contributor.authorJeon, Young-Dooko
dc.contributor.authorAhn, Seung Youngko
dc.contributor.authorYun, Young-Hwanko
dc.contributor.authorHam, Seog-Heonko
dc.contributor.authorLee, Yong-Heeko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2013-03-16T00:59:22Z-
dc.date.available2013-03-16T00:59:22Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1999-04-06-
dc.identifier.citationProceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315-
dc.identifier.urihttp://hdl.handle.net/10203/125776-
dc.languageEnglish-
dc.publisherSPIE-
dc.titleMicrowave frequency model of flip-chip interconnects using anisotropic conductive film-
dc.typeConference-
dc.identifier.wosid000082520700056-
dc.identifier.scopusid2-s2.0-0033363580-
dc.type.rimsCONF-
dc.citation.beginningpage311-
dc.citation.endingpage315-
dc.citation.publicationnameProceedings of the 1999 International Conference on High Density Packaging and MCMs-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationDenver, CO, USA-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorRyu, Woong Hwan-
dc.contributor.nonIdAuthorYim, Myung-Jin-
dc.contributor.nonIdAuthorLee, Junho-
dc.contributor.nonIdAuthorJeon, Young-Doo-
dc.contributor.nonIdAuthorAhn, Seung Young-
dc.contributor.nonIdAuthorYun, Young-Hwan-
dc.contributor.nonIdAuthorHam, Seog-Heon-
dc.contributor.nonIdAuthorLee, Yong-Hee-
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MS-Conference Papers(학술회의논문)EE-Conference Papers(학술회의논문)
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