Microwave Modeling and Characterization of Anisotropic conductive Adhesive Flip-Chip Interconnection

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 382
  • Download : 0
DC FieldValueLanguage
dc.contributor.author김정호-
dc.contributor.author백경욱-
dc.date.accessioned2013-03-16T00:43:57Z-
dc.date.available2013-03-16T00:43:57Z-
dc.date.created2012-02-06-
dc.date.issued1999-02-
dc.identifier.citation제6회 한국반도체 학술대회, v., no., pp.621 - 622-
dc.identifier.urihttp://hdl.handle.net/10203/125676-
dc.languageKOR-
dc.publisher한국반도체 학술대회-
dc.titleMicrowave Modeling and Characterization of Anisotropic conductive Adhesive Flip-Chip Interconnection-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage621-
dc.citation.endingpage622-
dc.citation.publicationname제6회 한국반도체 학술대회-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthor김정호-
dc.contributor.localauthor백경욱-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0