DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hong, Soon Hyung | - |
dc.date.accessioned | 2013-03-16T00:42:23Z | - |
dc.date.available | 2013-03-16T00:42:23Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999-01-01 | - |
dc.identifier.citation | Spring Meeting of the Korean Society for Composite Mateirals, v., no., pp.109 - 113 | - |
dc.identifier.uri | http://hdl.handle.net/10203/125664 | - |
dc.language | KOR | - |
dc.publisher | 한국복합재료학회 | - |
dc.title | Fabrication Process of High Thermal Conductivity and Low CTE SiCp/Al Metal Matrix Composite for Electronic Packaging Applications | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 109 | - |
dc.citation.endingpage | 113 | - |
dc.citation.publicationname | Spring Meeting of the Korean Society for Composite Mateirals | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Hong, Soon Hyung | - |
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