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College of Engineering(공과대학)Dept. of Bio and Brain Engineering(바이오및뇌공학과)BiS-Conference Papers(학술회의논문)

Locally heated low temperature wafer level mems packaging with closed-loop AuSn solder-lines

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dc.contributor.authorSeo, YH-
dc.contributor.authorKang, TG-
dc.contributor.authorCho, Young-Ho-
dc.contributor.authorKim, SA-
dc.contributor.authorKim, GH-
dc.contributor.authorBu, JU-
dc.date.accessioned2013-03-16T00:28:06Z-
dc.date.available2013-03-16T00:28:06Z-
dc.date.created2012-02-06-
dc.date.issued2002-11-17-
dc.identifier.citationASME 2002 International Mechanical Engineering Congress and Exposition, IMECE2002, v., no., pp.33 - 37-
dc.identifier.urihttp://hdl.handle.net/10203/125558-
dc.languageENG-
dc.titleLocally heated low temperature wafer level mems packaging with closed-loop AuSn solder-lines-
dc.typeConference-
dc.identifier.scopusid2-s2.0-78249290541-
dc.type.rimsCONF-
dc.citation.beginningpage33-
dc.citation.endingpage37-
dc.citation.publicationnameASME 2002 International Mechanical Engineering Congress and Exposition, IMECE2002-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorCho, Young-Ho-
dc.contributor.nonIdAuthorSeo, YH-
dc.contributor.nonIdAuthorKang, TG-
dc.contributor.nonIdAuthorKim, SA-
dc.contributor.nonIdAuthorKim, GH-
dc.contributor.nonIdAuthorBu, JU-
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BiS-Conference Papers(학술회의논문)
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