High current induced failure of ACAs flip chip joint
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kwon, WS | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2007-09-03T07:53:54Z | - |
| dc.date.available | 2007-09-03T07:53:54Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05-28 | - |
| dc.identifier.citation | 52nd Electronic Components and Technology Conference, pp.1130 - 1134 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1248 | - |
| dc.description.sponsorship | This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | High current induced failure of ACAs flip chip joint | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000176683800182 | - |
| dc.identifier.scopusid | 2-s2.0-0036287614 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1130 | - |
| dc.citation.endingpage | 1134 | - |
| dc.citation.publicationname | 52nd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kwon, WS | - |
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