Effect of process paramters on the uniformity in roughness and removal rate of wafer surface in the polishing process of silicon
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, DoHyun | - |
| dc.date.accessioned | 2013-03-15T21:27:48Z | - |
| dc.date.available | 2013-03-15T21:27:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-10-31 | - |
| dc.identifier.citation | Kyushu-Taejon/Chungnam symposium on chemical engineering, v., no., pp.25 - 26 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/124067 | - |
| dc.language | ENG | - |
| dc.title | Effect of process paramters on the uniformity in roughness and removal rate of wafer surface in the polishing process of silicon | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 25 | - |
| dc.citation.endingpage | 26 | - |
| dc.citation.publicationname | Kyushu-Taejon/Chungnam symposium on chemical engineering | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Kim, DoHyun | - |
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