DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Cited 2 time in webofscience Cited 0 time in scopus
  • Hit : 1388
  • Download : 1991
Export
DC FieldValueLanguage
dc.contributor.authorSon, HYko
dc.contributor.authorChung, CKko
dc.contributor.authorYim, MJko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-03T05:44:23Z-
dc.date.available2007-09-03T05:44:23Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-05-30-
dc.identifier.citationIEEE 56th Electronic Components and Technology Conference, pp.565 - 569-
dc.identifier.urihttp://hdl.handle.net/10203/1226-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleWafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections-
dc.typeConference-
dc.identifier.wosid000238566600088-
dc.identifier.scopusid2-s2.0-33845589842-
dc.type.rimsCONF-
dc.citation.beginningpage565-
dc.citation.endingpage569-
dc.citation.publicationnameIEEE 56th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorChung, CK-
dc.contributor.nonIdAuthorYim, MJ-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 2 items in WoS Click to see citing articles in records_button

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0