Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-15T14:39:28Z | - |
| dc.date.available | 2013-03-15T14:39:28Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-03-01 | - |
| dc.identifier.citation | 2nd electronic Packaging Technology Conference, v., no., pp.69 - 75 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/120353 | - |
| dc.language | ENG | - |
| dc.title | Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 69 | - |
| dc.citation.endingpage | 75 | - |
| dc.citation.publicationname | 2nd electronic Packaging Technology Conference | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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