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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Board-level clock distribution using laminated end-tapered fiber bundles

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Li, Y / Popelek, J. / Wang, T / Rhee, June-Koo Kevin researcher / Wang, L. J.

Publisher: SPIE

Issue Date: 1998-01

Language: ENG

Citation: Proc. SPIE-Int. Soc. Opt. Eng, v.3288, pp.85 - 88

URI: http://hdl.handle.net/10203/119697

Appears in Collection: EE-Conference Papers(학술회의논문)

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