Design and strength evaluation of an anodically bonded pressurized cavity array for wafer-level MEMS packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Go, Jeung Sang | - |
| dc.contributor.author | Cho, Young-Ho | - |
| dc.date.accessioned | 2013-03-15T12:43:16Z | - |
| dc.date.available | 2013-03-15T12:43:16Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-11-15 | - |
| dc.identifier.citation | Inter. Mechanical Engineering Congress and Exposition (IMECE '98),, v.66, no., pp.357 - 360 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/119556 | - |
| dc.language | ENG | - |
| dc.title | Design and strength evaluation of an anodically bonded pressurized cavity array for wafer-level MEMS packaging | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0032297029 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 66 | - |
| dc.citation.beginningpage | 357 | - |
| dc.citation.endingpage | 360 | - |
| dc.citation.publicationname | Inter. Mechanical Engineering Congress and Exposition (IMECE '98), | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Cho, Young-Ho | - |
| dc.contributor.nonIdAuthor | Go, Jeung Sang | - |
- Appears in Collection
- BiS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.