MOCVD 법에 의한 Cu 박막의 증착속도 및 증착두께 분포Deposition Rate and Thickness Distribution of Cu Film by MOCVD Process
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 정원영 | - |
| dc.contributor.author | 이경옥 | - |
| dc.contributor.author | 조영상 | - |
| dc.contributor.author | 김도현 | - |
| dc.date.accessioned | 2013-03-15T08:39:41Z | - |
| dc.date.available | 2013-03-15T08:39:41Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1995-04 | - |
| dc.identifier.citation | KIChE Spring Meeting, v., no., pp.844 - 847 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/117933 | - |
| dc.language | KOR | - |
| dc.title | MOCVD 법에 의한 Cu 박막의 증착속도 및 증착두께 분포 | - |
| dc.title.alternative | Deposition Rate and Thickness Distribution of Cu Film by MOCVD Process | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 844 | - |
| dc.citation.endingpage | 847 | - |
| dc.citation.publicationname | KIChE Spring Meeting | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 김도현 | - |
| dc.contributor.nonIdAuthor | 정원영 | - |
| dc.contributor.nonIdAuthor | 이경옥 | - |
| dc.contributor.nonIdAuthor | 조영상 | - |
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