Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, Soon-Jin | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-15T04:24:13Z | - |
| dc.date.available | 2013-03-15T04:24:13Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1996-12-03 | - |
| dc.identifier.citation | Proceedings of the 1996 MRS Fall Symposium, v.445, no., pp.275 - 280 | - |
| dc.identifier.issn | 0272-9172 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/116351 | - |
| dc.language | ENG | - |
| dc.publisher | Materials Research Society | - |
| dc.title | Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0031340733 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 445 | - |
| dc.citation.beginningpage | 275 | - |
| dc.citation.endingpage | 280 | - |
| dc.citation.publicationname | Proceedings of the 1996 MRS Fall Symposium | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Cho, Soon-Jin | - |
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