GaAs multichip packaging using the Selectively Oxidized Porous Silicon(SOPS) substrate
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Nam Ch.-M. | ko |
| dc.contributor.author | Jung I.-H. | ko |
| dc.contributor.author | Lee J.-S. | ko |
| dc.contributor.author | Cho Y.-H. | ko |
| dc.contributor.author | Kwon, Young Se | ko |
| dc.date.accessioned | 2013-03-15T02:13:46Z | - |
| dc.date.available | 2013-03-15T02:13:46Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-10-26 | - |
| dc.identifier.citation | Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, pp.113 - 115 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/115661 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | GaAs multichip packaging using the Selectively Oxidized Porous Silicon(SOPS) substrate | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000078238300026 | - |
| dc.identifier.scopusid | 2-s2.0-0032287897 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 113 | - |
| dc.citation.endingpage | 115 | - |
| dc.citation.publicationname | Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | West Point, NY, USA | - |
| dc.contributor.localauthor | Kwon, Young Se | - |
| dc.contributor.nonIdAuthor | Nam Ch.-M. | - |
| dc.contributor.nonIdAuthor | Jung I.-H. | - |
| dc.contributor.nonIdAuthor | Lee J.-S. | - |
| dc.contributor.nonIdAuthor | Cho Y.-H. | - |
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