Dynamic Studies on the Formation of Voids in Wafer Bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 강상원 | - |
| dc.date.accessioned | 2013-03-14T21:19:12Z | - |
| dc.date.available | 2013-03-14T21:19:12Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1992 | - |
| dc.identifier.citation | 한국전자공학회, 92춘계전자공학회 논문집, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/113421 | - |
| dc.language | KOR | - |
| dc.title | Dynamic Studies on the Formation of Voids in Wafer Bonding | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 한국전자공학회, 92춘계전자공학회 논문집 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 강상원 | - |
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