Deposition Characteristics of TiCN Deposited by Plasma Enhanced Chemical Vapor Deposition
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chun , Soung Soon | ko |
| dc.date.accessioned | 2013-03-14T16:12:21Z | - |
| dc.date.available | 2013-03-14T16:12:21Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1989-05 | - |
| dc.identifier.citation | Proc. 7th Int'l Conf. on Ion & Plasma Assisted Techniques, pp.254 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/110614 | - |
| dc.language | English | - |
| dc.publisher | International Conference on Ion and Plasma Assisted Techniques | - |
| dc.title | Deposition Characteristics of TiCN Deposited by Plasma Enhanced Chemical Vapor Deposition | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 254 | - |
| dc.citation.publicationname | Proc. 7th Int'l Conf. on Ion & Plasma Assisted Techniques | - |
| dc.identifier.conferencecountry | SZ | - |
| dc.identifier.conferencelocation | Geneva, Switzerland | - |
| dc.contributor.localauthor | Chun , Soung Soon | - |
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