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Showing results 1 to 3 of 3

1
Effects of substrate bias voltage on plasma parameters in temperature control using a grid system

Bai, KH; Hong, JI; You, SJ; Chang, Hong-Young, PHYSICS OF PLASMAS, v.8, no.9, pp.4246 - 4250, 2001-09

2
Numerical investigation on plasma and poly-Si etching uniformity control over a large area in a resonant inductively coupled plasma source

S. S. Kim; S. Hamaguchi; N. S. Yoon; Chang, Choong-Seock; Y. D. Lee; S. H. Ku, PHYSICS OF PLASMAS, v.8, no.4, pp.1384 - 1394, 2001-04

3
Si etching rate calculation for low pressure high density plasma source using Cl-2 gas

Lee, YD; Chang, Hong-Young; Chang, Choong-Seock, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.18, no.5, pp.2224 - 2229, 2000

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