DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sang-Won Kang | - |
dc.date.accessioned | 2013-03-14T09:58:25Z | - |
dc.date.available | 2013-03-14T09:58:25Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1991 | - |
dc.identifier.citation | ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, v., no., pp.102 - | - |
dc.identifier.uri | http://hdl.handle.net/10203/107605 | - |
dc.language | ENG | - |
dc.title | Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 102 | - |
dc.citation.publicationname | ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Sang-Won Kang | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.