DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | - |
dc.contributor.author | krishnamurthy | - |
dc.contributor.author | Lester, D | - |
dc.date.accessioned | 2013-03-14T05:43:07Z | - |
dc.date.available | 2013-03-14T05:43:07Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1992 | - |
dc.identifier.citation | Proceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference, v., no., pp.719 - 724 | - |
dc.identifier.uri | http://hdl.handle.net/10203/105794 | - |
dc.language | ENG | - |
dc.title | Characteization of Polymer die-Attach Adhesives on Au and Al surfaces | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 719 | - |
dc.citation.endingpage | 724 | - |
dc.citation.publicationname | Proceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | krishnamurthy | - |
dc.contributor.nonIdAuthor | Lester, D | - |
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