Characteization of Polymer die-Attach Adhesives on Au and Al surfaces

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dc.contributor.authorPaik, Kyung-Wook-
dc.contributor.authorkrishnamurthy-
dc.contributor.authorLester, D-
dc.date.accessioned2013-03-14T05:43:07Z-
dc.date.available2013-03-14T05:43:07Z-
dc.date.created2012-02-06-
dc.date.issued1992-
dc.identifier.citationProceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference, v., no., pp.719 - 724-
dc.identifier.urihttp://hdl.handle.net/10203/105794-
dc.languageENG-
dc.titleCharacteization of Polymer die-Attach Adhesives on Au and Al surfaces-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage719-
dc.citation.endingpage724-
dc.citation.publicationnameProceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorkrishnamurthy-
dc.contributor.nonIdAuthorLester, D-
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MS-Conference Papers(학술회의논문)
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