Characterization of Process-Induced Damage During Aluminum Etching and Photoresist Ashing
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hyung-Cheol Shin | - |
| dc.date.accessioned | 2013-03-14T05:18:12Z | - |
| dc.date.available | 2013-03-14T05:18:12Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1991 | - |
| dc.identifier.citation | International Wafer Level Reliability Workshop, v., no., pp.133 - 144 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/105618 | - |
| dc.language | ENG | - |
| dc.title | Characterization of Process-Induced Damage During Aluminum Etching and Photoresist Ashing | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 133 | - |
| dc.citation.endingpage | 144 | - |
| dc.citation.publicationname | International Wafer Level Reliability Workshop | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Hyung-Cheol Shin | - |
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