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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Journal Papers(저널논문)

Special Issue: High/Low Temperature Adhesive Bonding Technology

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Lee, Dai Gilresearcher
Publisher
TAYLOR & FRANCIS LTD
Issue Date
2012
Language
English
Article Type
Editorial Material
Citation

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.26, no.7, pp.885 - 887

ISSN
0169-4243
DOI
10.1163/156856111X620486
URI
http://hdl.handle.net/10203/103604
Appears in Collection
ME-Journal Papers(저널논문)
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